畢業(yè)設(shè)計(jì)--波峰焊接工藝缺陷分析

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1、南京信息職業(yè)技術(shù)學(xué)院畢業(yè)設(shè)計(jì)論文作者學(xué)號系部機(jī)電學(xué)院專業(yè)電子組裝技術(shù)與設(shè)備(對口單招)題目波峰焊接的工藝缺陷分析指導(dǎo)教師評閱教師完成時(shí)間：年月日畢業(yè)設(shè)計(jì)(論文)中文摘要(題目)：波峰焊接的工藝缺陷分析摘要：波峰焊是指將熔化的軟釬焊料（鉛錫合金），經(jīng)電動(dòng)泵或電磁泵噴流成設(shè)計(jì)要求的焊料波峰，亦可通過向焊料池注入氮?dú)鈦硇纬?，使預(yù)先裝有元器件的印制板通過焊料波峰，實(shí)現(xiàn)元器件焊端或引腳與印制板焊盤之間機(jī)械與電氣連接的軟釬焊，也可稱為群焊或流動(dòng)焊。這種焊接方法主要用于傳統(tǒng)通孔插裝工藝，以及表面組裝與通孔插裝元器件的混裝工藝，適合波峰焊的表面

2、貼裝元器件有矩形和圓柱形片式元件、SOT以及較小的SOP器件等。波峰的焊中可能出現(xiàn)的缺陷主要是焊點(diǎn)缺陷、原件缺陷和PCB缺陷。本文通過介紹波峰焊的定義、工藝方式、缺陷分析等，正確引導(dǎo)讀者在操作過程中應(yīng)該注意的部分，提出波峰焊的缺陷并指導(dǎo)讀者正確解決波峰焊的缺陷。關(guān)鍵詞：波峰焊通孔插裝缺陷分析畢業(yè)設(shè)計(jì)(論文)外文摘要Title:WavesolderingdefectsanalysisAbstract:Wavesolderingistopointtowillmeltsoftthesoldering(leadsolderalloy),

3、theelectricpumporelectromagneticpumpsprayflowintothedesignrequirementsofsolderwave,canalsothroughintothepooltosoldernitrogentoform,inadvanceoftheprintedcircuitboardismadewithcomponentsbysolderwave,realizethepinsorcomponentsweldingandweldingplatemechanicalandPCBelectr

4、icalconnectionbetweenthesoftbrazing,canalsobecalledgroupofweldingorflowwelding.Thiskindofweldingmethodismainlyusedintheholeistraditionalcartridgeprocess,aswellassurfaceassemblyandholecartridgecomponentsofdualprocess,suitableforwavesolderingSMTcomponentsarerectangular

5、andcylindricalchipcomponents,SOTandsmallerSOPdevices,etc.Waveofweldingofthepotentialdefectsismainlysolderdefects,theoriginaldefectsandPCBdefects.Thispaperintroducesthedefinition,wavesolderingprocess,processanalysis,defectanalysis,thecorrectguidancereadersinoperations

6、houldbepaidattentiontoduringthepart,andputsforwardthesolderingdefectandguidethereadercorrectlysolvedthedefectsofsoldering.Keyword:WavesolderingThrough-holeCartridgeDefectsAnalysis目錄1引言····························································12波峰焊的基本概念·············

7、···································12.1波峰焊的分類················································12.2波峰焊機(jī)的組成··············································23波峰焊的工藝····················································23.1波峰焊的工藝方式············································2

8、3.2波峰焊接工藝參數(shù)設(shè)置········································34波峰焊接常見缺陷分析及解決方法··································34.1波峰焊接中常見的缺陷現(xiàn)象···········