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1、專門術(shù)語By張興隆AI:Auto-Insertion自動插件AQL:acceptablequalitylevel允收水準(zhǔn)ATE:automatictestequipment自動測試ATM:atmosphere氣壓BGA:ballgridarray球形矩陣CCD:chargecoupleddevice監(jiān)視連接元件(攝影機(jī))CLCC:Ceramicleadlesschipcarrier陶瓷引腳載具COB:chip-on-board晶片直接貼附在電路板上cps:centipoises(黏度單位)百分之一CSB:chipscaleballgridarray晶片尺
2、寸BGACSP:chipscalepackage晶片尺寸構(gòu)裝CTE:coefficientofthermalexpansion熱膨脹系數(shù)DIP:dualin-linepackage雙內(nèi)線包裝(泛指手插元件)FPT:finepitchtechnology微間距技術(shù)FR-4:flame-retardantsubstrate玻璃纖維膠片(用來製作PCB材質(zhì))IC:integratecircuit積體電路IR:infra-red紅外線Kpa:kilopascals(壓力單位)LCC:leadlesschipcarrier引腳式晶片承載器MCM:multi-chi
3、pmodule多層晶片模組MELF:metalelectrodeface二極體MQFP:metalizedQFP金屬四方扁平封裝NEPCON:NationalElectronicPackageandProductionConference國際電子包裝及生產(chǎn)會議PBGA:plasticballgridarray塑膠球形矩陣PCB:printedcircuitboard印刷電路板PFC:polymerflipchipPLCC:plasticleadlesschipcarrier塑膠式有引腳晶片承載器Polyurethane聚亞胺酯(刮刀材質(zhì))ppm:part
4、spermillion指每百萬PAD(點)有多少個不良PAD(點)psi:pounds/inch2磅/英吋2PWB:printedwiringboard電路板QFP:quadflatpackage四邊平坦封裝SIP:singlein-linepackageSIR:surfaceinsulationresistance絕緣阻抗SMC:SurfaceMountComponent表面黏著元件SMD:SurfaceMountDevice表面黏著元件SMEMA:SurfaceMountEquipmentManufacturersAssociation表面黏著設(shè)備製
5、造協(xié)會SMT:surfacemounttechnology表面黏著技術(shù)SOIC:smalloutlineintegratedcircuitSOJ:smallout-linej-leadedpackageSOP:smallout-linepackage小外型封裝SOT:smalloutlinetransistor電晶體SPC:statisticalprocesscontrol統(tǒng)計過程控制SSOP:shrinksmalloutlinepackage收縮型小外形封裝TAB:tapeautomaticedbonding帶狀自動結(jié)合TCE:thermalcoeff
6、icientofexpansion膨脹(因熱)係數(shù)Tg:glasstransitiontemperature玻璃轉(zhuǎn)換溫度THD:Throughholedevice須穿過洞之元件(貫穿孔)TQFP:tapequadflatpackage帶狀四方平坦封裝UV:ultraviolet紫外線uBGA:microBGA微小球型矩陣cBGA:ceramicBGA陶瓷球型矩陣PTH:PlatedThruHole導(dǎo)通孔IA:InformationAppliance資訊家電產(chǎn)品I.Q.C.:IncomingQualityControlI.P.Q.C.:InProcessQ
7、ualityControlMESH網(wǎng)目OXIDE氧化物FLUX助焊劑LGA(LandGridArray)封裝技術(shù)LGA封裝不需植球，適合輕薄短小產(chǎn)品應(yīng)用。TCP(TapeCarrierPackage)ACFAnisotropicConductiveFilm異方性導(dǎo)電膠膜製程Soldermask防焊漆SolderingIron烙鐵Solderballs錫球SolderSplash錫渣SolderSkips漏焊Throughhole貫穿孔Touchup補(bǔ)焊Birding穚接(短路)SolderWires焊錫線SolderBars錫棒GreenStrength
8、未固化強(qiáng)度(紅膠)TransterPressure轉(zhuǎn)印壓力(印刷)ScreenP
