《LED元件簡介》PPT課件

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1、LED元件簡介@@@@2008/1/24目錄LED晶片概論LEDLampChipTypeLED(SMDLED)最近的發(fā)展趨勢LED發(fā)光原理TypesofLEDChipsGaP/GaP:Red/YellowGreenAlGaAs/GaAs:Red(UR,SR),IRGaAsP/GaAs:Red(SRD)GaAs/GaP:OrangeGaAsP/GaP:YellowAlInGap/GaAs:AS四元(Red/Orange/Yellow)AlInGaP/GaP:TS四元(Red/Orange/Yellow)InGaN/Saphire:Blue/

2、Green(Nichia)InGaN/SiC:Blue/Green(Cree)LEDChip(H5C)LEDChipSpecAS/TSAlInGaPChipStructureInGaN/SaphireChipStructure靜電打穿現(xiàn)象晶片供應(yīng)狀況項目供應(yīng)商型號紅光-ASOPTO/LumiledsED-H5C紅光-ASOPTO/HitachiCableED-012UOR紅/黃光-TSLumiledsHWFR-B510/B310紅光-TSOPTO/LumiledsED-S5A藍光UniroyalUNPRC470藍/綠光CreeC525/4

3、70-UB290藍/綠光CreeC525/470-MB290藍/綠光CreeC525/470-XB290藍光OPTO/燦圓ED-014BL藍光OPTO/連勇ED-014BLLEDLampPackageLEDLampStopper高度Stopper高度ABCLEDLampColorLEDLampSpec.ITEMSymbolMaximumRating/RMaximumRating/B&GUnitForwardCurrentIF5030mAPulseForwardCurrentIFP200100mAReverseVoltageVR55VPow

4、erDissipationPD120120mWOperatingTemperatureTopr-30~+85CStorageTemperatureTstg-40~+100CLeadSolderingTemperatureTsol260Cfor5secLEDLampSpec.ItemSymbolConditionRGBUnitForwardVoltageVFIF=20(mA)1.93.53.5VReverseCurrentIRVR=5(V)Max50Max50Max50uALuminousIntensityTIVIF=20(mA)21006

5、20mcdSIVIF=20(mA)1500440mcdRIVIF=20(mA)3801060310mcdQIVIF=20(mA)265mcdHowtoMakeWhiteLED銀膠烘烤LEDLampProcess固晶(DieAttach)打線(WireBonding)灌膠(Encap)短烤(PreCure)長烤(PostCure)銀膠量180C1.5Hr推力測試320~350C拉力測試導(dǎo)柱/無導(dǎo)柱模粒使用次數(shù)120~140C1Hr氣密性測試125C6HrT/G點(130C)VF,IV,WD測試分Bin支架(LeadFrame)固晶(Dice

6、Attach)打線(WireBonding)模粒(灌膠模)噴離模劑注膠沾膠與插入灌膠模已灌膠之半成品烘烤(50min)(Pre-Cure)半成品第一次切腳(正負極)電性及外觀檢驗第二次切腳分BinLED封裝常見問題偏心(offcenter)晶高不均Open/Short水氣滲入漏電:IR,VF(100uA)PCB污染熱應(yīng)力不良Lamp供應(yīng)狀況(Display)供應(yīng)商波長角度型號Nichia626nm-AS70NSPR636AS525nm70NSPG636AS470nm70NSPB636ASNichia626nm120NSPR546BS525

7、nm120NSPG546BS470nm120NSPB546BSCotCo626nm-TS120LO565THR4Agilent626nm-TS120HLMP-SD11三得626nm-AS1204K3RD-S626nm-TS1204K3TRD-S/T供應(yīng)商波長角度型號Nichia505nm30NSPE510Swhite20NSPW500BS三得626nm-TS30SDL-5N3TR592nm-TS30SDL-5N3TY605nm30SDL-5N3SOS興華626nm-TS30CSL-U56204W-ETLamp供應(yīng)狀況(交通燈)ChipTy

8、peLEDPCBTypeChipLEDLeadFrameTypeChipLEDChipLED製程銀膠烘烤固晶(DieAttach)打線(WireBonding)Molding測試切割分Bin銀