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1、印刷電路板流程介紹教育訓(xùn)練教材流程圖PCBMfg.FLOWCHART顧客(CUSTOMER)工程製前(FRONT-ENDDEP.)裁板(LAMINATESHEAR)內(nèi)層乾膜(INNERLAYERIMAGE)預(yù)疊板及疊板(LAY-UP)通孔電鍍(P.T.H.)液態(tài)防焊(LIQUIDS/M)外觀檢查(VISUALINSPECTION)成型(FINALSHAPING)業(yè)務(wù)(SALESDEPARTMENT)生產(chǎn)管理(P&MCONTROL)蝕銅(I/LETCHING)鑽孔(PTHDRILLING)壓合(LAMINATION)外層乾膜(OUTERLAYE
2、RIMAGE)二次銅及錫鉛電鍍(PATTERNPLATING)蝕銅(O/LETCHING)檢查(INSPECTION)噴錫(HOTAIRLEVELING)電測(ELECTRICALTEST)出貨前檢查(OQC)包裝出貨(PACKING&SHIPPING)曝光(EXPOSURE)壓膜(LAMINATION)前處理(PRELIMINARYTREATMENT)顯影(DEVELOPIG)蝕銅(ETCHING)去膜(STRIPPING)黑化處理(BLACKOXIDE)烘烤(BAKING)預(yù)疊板及疊板(LAY-UP)壓合(LAMINATION)後處理(P
3、OSTTREATMENT)曝光(EXPOSURE)壓膜(LAMINATION)二次銅電鍍(PATTERNPLATING)錫鉛電鍍(T/LPLATING)去膜(STRIPPING)蝕銅(ETCHING)剝錫鉛(T/LSTRIPPING)塗佈印刷(S/MCOATING)預(yù)乾燥(PRE-CURE)曝光(EXPOSURE)顯影(DEVELOPING)後烘烤(POSTCURE)多層板內(nèi)層流程(INNERLAYERPRODUCT)MLB全板電鍍(PANELPLATING)銅面防氧化處理(OSP(EntekCu106A)外層製作(OUTER-LAYER)T
4、ENTINGPROCESS鍍金手指(G/FPLATING)鍍化學(xué)鎳金(E-lessNi/Au)選擇性鍍鎳鍍金(SELECTIVEGOLD)印文字(SCREENLEGEND)網(wǎng)版製作(STENCIL)圖面(DRAWING)工作底片(WORKINGA/W)製作規(guī)範(fàn)(RUNCARD)程式帶(PROGRAM)鑽孔,成型機(jī)(D.N.C.)底片(MASTERA/W)磁片,磁帶(DISK,M/T)藍(lán)圖(DRAWING)資料傳送(MODEM,FTP)AOI檢查(AOIINSPECTION)除膠渣(DESMER)通孔電鍍(E-LESSCU)DOUBLESIDE
5、前處理(PRELIMINARYTREATMENT)前處理(PRELIMINARYTREATMENT)前處理(PRELIMINARYTREATMENT)ForO.S.P.印刷電路板流程介紹P2(1)前製程治工具製作流程鑽孔,成型機(jī)D.N.C.BROADTECHOLOGYINC.BROADTECHOLOGYINC.顧客CUSTOMER裁板LAMINATESHEAR業(yè)務(wù)SALESDEP.生產(chǎn)管理P&MCONTROLMASTERA/W底片DISK,M/T磁片磁帶藍(lán)圖DRAWING資料傳送MODEM,FTP網(wǎng)版製作STENCILDRAWING圖面RUN
6、CARD製作規(guī)範(fàn)PROGRAM程式帶工程製前FRONT-ENDDEP.工作底片WORKINGA/W印刷電路板流程介紹P3(2)多層板內(nèi)層製作流程BROADTECHOLOGYINC.BROADTECHOLOGYINC.曝光EXPOSURE壓膜LAMINATION前處理PRELIMINARYTREATMENT去膜STRIPPING蝕銅ETCHING顯影DEVELOPING黑化處理BLACKOXIDE烘烤BAKINGLAY-UP預(yù)疊板及疊板後處理POSTTREATMENT壓合LAMINATION內(nèi)層乾膜INNERLAYERIMAGE預(yù)疊板及疊板LA
7、Y-UP蝕銅I/LETCHING鑽孔DRILLING壓合LAMINATION多層板內(nèi)層流程INNERLAYERPRODUCTMLBAOI檢查AOIINSPECTION裁板LAMINATESHEARDOUBLESIDE印刷電路板流程介紹P4(3)外層製作流程BROADTECHOLOGYINC.BROADTECHOLOGYINC.通孔電鍍P.T.H.鑽孔DRILLING外層乾膜OUTERLAYERIMAGE二次銅及錫鉛電鍍PATTERNPLATING檢查INSPECTION前處理PRELIMINARYTREATMENT二次銅電鍍PATTERNPL
8、ATING蝕銅ETCHING全板電鍍PANELPLATING外層製作OUTER-LAYERO/LETCHING蝕銅TENTINGPROCESSDESMER除膠渣E-
