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1、SEMIG28-0997N/A?SEMI1986,1997SPECIFICATIONFORLEADFRAMESFORPLASTICMOLDEDS.O.PACKAGES1Purpose4.4coinedarea?ThatareaatthetipofthebondTn-gers?attenedtoproduceanacceptablesurfaceforwireThisspeciTcationdeTnestheacceptancecriteriaforbonding(seeFigure3).stampedleadfr
2、amesforplasticmoldedS.O.packages.4.5crossbow?Transversebowingoftheleadframe2Scope(seeFigure4).ThisspeciTcationisaguidelineforproductionof4.6functionalarea?ThedieattachpadandthewirestampedS.O.Leadframestobeusedinplasticmoldedbond(leadtips)area.S.O.packages.4.7
3、leadtwist?AngularrotationofbondingTngers(seeFigure5).3ReferencedDocuments3.1SEMISpeciTcations4.8pit?Ashallowsurfacedepressionorcraterintheleadframematerial.SEMIG4?SpecificationforIntegratedCircuitLead-frameMaterialsusedintheProductionofStamped4.9slugmarks?Ran
4、domdentsintheleadframeLeadframescausedbyforeignmaterialinthestampingdie.SEMIG9?SpecificationforStampedLeadframesfor4.10stampedleadframeterminology?(SeeFigurePlasticMoldedDual-In-LineSemiconductorPackages6.)SEMIG10?StandardMethodforMechanicalMea-5OrderingInfor
5、mationsurementforPlasticPackageLeadframesPurchaseordersforleadframesforplasticmoldedS.O.SEMIG21?SpecificationforPlatingIntegratedCir-packagesfurnishedtothisspeciTcationshallincludecuitLeadframesthefollowingitems:3.2ANSI/ASQCSpeciTcations1a.Currentleadframespe
6、ciTcationdrawing.ANSI/ASQCZ1.4?SamplingProceduresandTablesb.AlldimensionsandtolerancesperANSIY14.5forInspectionbyAttributespractices.3.3ANSISpeciTcations2c.Materialtypeandphysicalcharacteristics(seeSEMIG4).ANSIY14.5M?DimensioningandTolerancingd.Typehardnessan
7、dthicknessofanyrequiredplat-4Terminologying(seeSEMIG21).4.1burr?Afragmentofexcessmaterialeitherhori-zontalorverticaladheringtothecomponentsurface.6DimensionsSeeTable1andFigure7forstandarddimensions.Tol-4.2camber?Curvatureoftheleadframestripedgeinerancesshallb
8、eagreedbetweenvendorandcustomer.thehorizontalplane(seeFigure1).4.3coilset?Longitudinalbowingoftheleadframe7DefectLimitsandParameters(seeFigure2).(seeSEMIG10formeasurementmethods)7.1Intern
