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1、IPC-7351BGenericRequirementsforSurfaceMountDesignandLandPatternStandardFINALDRAFTFORINDUSTRYREVIEW–AUGUST20091SCOPEThisdocumentprovidesinformationonlandpatterngeometriesusedforthesurfaceattachmentofelectroniccomponents.Theintentoftheinformationpresentedher
2、einistoprovidetheappropriatesize,shapeandtoleranceofsurfacemountlandpatternstoinsuresufficientareafortheappropriatesolder?llettomeettherequirementsofIPCJ-STD-001,andalsotoallowforinspection,testing,andreworkofthosesolderjoints.1.1PurposeAlthough,inmanyinst
3、ances,thelandpatterngeometriescanbedifferentbasedonthetypeofsolderingusedtoattachtheelectronicpart,whereverpossible,landpatternsarede?nedwithconsiderationtotheattachmentprocessbeingused.Designerscanusetheinformationcontainedhereintoestablishstandardcon?gur
4、ationsnotonlyformanualdesignsbutalsoforcomputer-aideddesignsystems.Whetherpartsaremountedononeorbothsidesoftheprintedboard,subjectedtowave,re?ow,orothertypeofsoldering,thelandpatternandpartdimensionsshouldbeoptimizedtoinsurepropersolderjointandinspectioncr
5、iteria.Landpatternsaredimensionallyde?nedandareapartoftheprintedboardcircuitrygeometry,astheyaresubjecttotheproducibilitylevelsandtolerancesassociatedwithplating,etching,assemblyorotherconditions.Theproducibilityaspectsalsopertaintotheuseofsoldermaskandthe
6、registrationrequiredbetweenthesoldermaskandtheconductorpatterns.Note1:Thedimensionsusedforcomponentdescriptionshavebeenextractedfromstandardsdevelopedbyindustrialand/orstandardsbodies.Designersshouldrefertothesestandardsforadditionalorspeci?ccomponentpacka
7、gedimensions.Note2:Foracomprehensivedescriptionofthegivenprintedboardandforachievingthebestpossiblesolderjointstothedevicesassembled,thewholesetofdesignelementsincludes,besidethelandpatternde?nition:?Soldermask?Solderpastestencil?Clearancebetweenadjacentco
8、mponents?Clearancebetweenbottomofcomponentandprintedboardsurface,ifrelevant?Keepoutareas,ifrelevant?SuitablerulesforadhesiveapplicationsThewholeofdesignelementsiscommonlyde?nedas‘‘mountingconditions.’’Thissta
