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1、SEMIG75.13-0698C?SEMI1998TESTMETHODFORMEASUREMENTOFTHELEAKAGECURRENTINLEADFRAMETAPE1SummaryofMethod1.1Tapedleadframesaremoldedundernormalcondi-tions,andtheleakagecurrentbetweendesignatedleadsismeasuredbeforeandaftersubmittingthesam-plestoHAST(121?C/2atm/100%RH)m
2、oisturetest-ing.2Equipment2.1HASTChamber2.2Amperemeterwith10-15amperemeasuringcapa-bility2.3Powersupplycapableof500voltsDCmaximum2.4Electrostaticallyandelectromagneticallyshieldedbox3Sampling3.1Thesamplingisonesampleperonelot.Theven-dormustreportthedeTnitionoflo
3、tifthecustomerrequiresit.4PreparationofSpecimens4.1Leadframesshallbecleanedupprevioustotaping,usingaprocedureagreedonbetweenvendorandcus-tomer.4.2TapingConditions?Temperature,pressure,anddwelltimeshallbeagreedonbetweenvendorandcus-tomer.NOTE1:Atypicaltaped40pinD
4、IPleadframeisshowninFigure1,andrelevantinformationforthisframeistabulatedinTable1.1SEMIG75.13-0698?SEMI1998Figure1TypicalTaped40PinDIPLeadframeTable1.RelevantInformationfor40PinDIPLeadframeLeadframeAttributeSpeciTcationLeadframethickness0.25mmLeadframematerialAl
5、loy42LeadframemanufacturingprocessStampingPlatingNone/Silver/OthersSurfacetreatmentTobeagreedbetweentapeuserandsupplier.NOTE2:ThesurfacestateofAlloy42isstablecomparedwithCualloy,whichisoxidizedeasily.4.3Theleadframesshallbemoldedusingmoldingcompoundsandcuredwith
6、postmoldcuringconditionsagreedonbetweenvendorandcustomer.Theuntapedleadframeshallbepreparedwiththesameprocedureasacontrol.4.4Trimtheleadsaccordingtoaprocedureagreedonbetweenvendorandcustomer.SEMIG75.13-0698?SEMI199825Procedure6RelatedDocuments5.1Setupthetestcirc
7、uitasshowninFigure2.6.1ASTMSpeciTcation1ASTMD257?TestMethodsforD-CResistanceorConductanceofInsulatingMaterials6.2JISSpeciTcation2JISK6911?TestingMethodsforThermosettingPlasticsNOTICE:Thesestandardsdonotpurporttoaddresssafetyissues,ifany,associatedwiththeiruse.It
8、istheresponsibilityoftheuserofthesestandardstoestablishappropriatesafetyandhealthpracticesanddeterminetheapplicabilityofregulatorylimitationspriortouse.SEMImakesnowar
