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1、Abstractshownthatusingthelargepartlclessilverpowderasthemainfillingmaterialsandaddingacertainamountofsilvernanorodandsilvernanowirecanimprovetheconductivity.Becausethesilvernanorodscanbefilledinthegapofsilverflakeandbeusedasashortrideassociatedconductivepaths,toincreaseconductivepathsandformthecondu
2、ctivenetwork.Itcanhelptoreducethevolumeresistivityofconductiveadhesive.Thenanoparticlescanbefilledinanon-contactareaofsilverflakeandnanorods,anditwillmakemoreperfectconductivenetwork,therebyreducingthevolumeresistivityofconductiveadhesive.Keywords:silvernanowires,silvernanoparticles,polyolreductionm
3、ethod,conductiveadhesive-III-萬方數(shù)據(jù)目錄目錄摘要..................................................................................................................IABSTRACT........................................................................................................II第1章緒論...........................
4、........................................................................11.1課題背景及研究的目的和意義..........................................................11.2銀納米材料的研究現(xiàn)狀.....................................................................21.3銀納米材料的制備與應用.......................................................
5、..........31.3.1銀納米材料的制備方法.....................................................................31.3.2銀納米材料的應用............................................................................51.4導電膠概述........................................................................................71.4.1導電膠簡介.......
6、.................................................................................71.4.2導電膠研究進展................................................................................91.5本文的主要研究內容........................................................................11第2章實驗原理及表征方法...........................
7、..............................................122.1銀納米結構的制備機理與方法........................................................122.1.1合成原理.....................................................................
