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1、半導(dǎo)體封裝制程與設(shè)備材料知識(shí)簡介PrepareBy：WilliamGuo 2007.11Update半導(dǎo)體封裝制程概述半導(dǎo)體前段晶圓wafer制程半導(dǎo)體后段封裝測試封裝前段（B/G-MOLD）－封裝后段（MARK-PLANT）－測試封裝就是將前製程加工完成後所提供晶圓中之每一顆IC晶粒獨(dú)立分離，並外接信號(hào)線至導(dǎo)線架上分離而予以包覆包裝測試直至IC成品。半導(dǎo)體制程Oxidization(氧化處理)Lithography(微影)Etching(蝕刻)DiffusionIonImplantation(擴(kuò)散離子植入)Deposition(沉積)WaferInspec
2、tion(晶圓檢查)Grind&Dicing(晶圓研磨及切割)DieAttach(上片)WireBonding(焊線)Molding(塑封)Package(包裝)WaferCutting(晶圓切斷)WaferReduce(晶圓減薄)LaserCut&packagesaw(切割成型)Testing(測試)Lasermark(激光印字)IC制造開始前段結(jié)束后段封裝開始製造完成封裝型式(PACKAGE)ThroughHoleMountShapeMaterialLeadPitchNoofI/OTypicalFeaturesCeramicPlastic2.54mm(1
3、00miles)8~64DIPDualIn-linePackagePlastic2.54mm(100miles)1directionlead3~25SIPSingleIn-linePackage封裝型式ThroughHoleMountShapeMaterialLeadPitchNoofI/OTypicalFeaturesPlastic2.54mm(100miles)1directionlead16~24ZIPZigzagIn-linePackagePlastic1.778mm(70miles)20~64S-DIPShrinkDualIn-linePackag
4、e封裝型式ThroughHoleMountShapeMaterialLeadPitchNoofI/OTypicalFeaturesCeramicPlastic2.54mm(100miles)half-sizepitchinthewidthdirection24~32SK-DIPSkinnyDualIn-linePackageCeramicPlastic2.54mm(100miles)PBGAPinGridArray封裝型式SurfaceMountShapeMaterialLeadPitchNoofI/OTypicalFeaturesPlastic1.27mm
5、(50miles)2directionlead8~40SOPSmallOutlinePackagePlastic1.0,0.8,0.65mm4directionlead88~200QFPQuad-FlatPack封裝型式SurfaceMountShapeMaterialLeadPitchNoofI/OTypicalFeaturesCeramic1.27,0.762mm(50,30miles)2,4directionlead20~80FPGFlatPackageofGlassCeramic1.27,1.016,0.762mm(50,40,30miles)20~
6、40LCCLeadlessChipCarrier封裝型式SurfaceMountShapeMaterialLeadPitchNoofI/OTypicalFeaturesCeramic1.27mm(50miles)j-shapebend4directionlead18~124PLCCPlasticLeadedChipCarrierCeramic0.5mm32~200VSQFVerySmallQuadFlatpackAssemblyMainProcessDieCure(Optional)DieBondDieSawPlasmaCardAsyMemoryTestCl
7、eanerCardTestPackingforOutgoingDetaping(Optional)Grinding(Optional)Taping(Optional)WaferMountUVCure(Optional)LasermarkPostMoldCureMoldingLaserCutPackageSawWireBondSMT(Optional)半導(dǎo)體設(shè)備供應(yīng)商介紹-前道部分PROCESSVENDORMODELSMT-PRINTERDEKHOR-2ISMT–CHIPMOUNTSIMENSHS-60TAPINGNITTODR3000-IIIINLINEGR
8、INDER&POLISHACCRETECHPG300
