資源描述：
《半導(dǎo)體封裝制程及其設(shè)備介紹上課講義.ppt》由會(huì)員上傳分享，免費(fèi)在線閱讀，更多相關(guān)內(nèi)容在教育資源-天天文庫(kù)。
1、半導(dǎo)體封裝制程與設(shè)備材料知識(shí)簡(jiǎn)介PrepareBy：WilliamGuo 2007.11Update半導(dǎo)體封裝制程概述半導(dǎo)體前段晶圓wafer制程半導(dǎo)體后段封裝測(cè)試封裝前段（B/G-MOLD）－封裝后段（MARK-PLANT）－測(cè)試封裝就是將前製程加工完成後所提供晶圓中之每一顆IC晶粒獨(dú)立分離，並外接信號(hào)線至導(dǎo)線架上分離而予以包覆包裝測(cè)試直至IC成品。封裝型式(PACKAGE)ThroughHoleMountShapeMaterialLeadPitchNoofI/OTypicalFeaturesCeramicPlastic2.54mm(100miles)8~64DIPDualIn
2、-linePackagePlastic2.54mm(100miles)1directionlead3~25SIPSingleIn-linePackage封裝型式ThroughHoleMountShapeMaterialLeadPitchNoofI/OTypicalFeaturesPlastic2.54mm(100miles)1directionlead16~24ZIPZigzagIn-linePackagePlastic1.778mm(70miles)20~64S-DIPShrinkDualIn-linePackage封裝型式ThroughHoleMountShapeMateri
3、alLeadPitchNoofI/OTypicalFeaturesCeramicPlastic2.54mm(100miles)half-sizepitchinthewidthdirection24~32SK-DIPSkinnyDualIn-linePackageCeramicPlastic2.54mm(100miles)PBGAPinGridArray封裝型式SurfaceMountShapeMaterialLeadPitchNoofI/OTypicalFeaturesPlastic1.27mm(50miles)2directionlead8~40SOPSmallOutlineP
4、ackagePlastic1.0,0.8,0.65mm4directionlead88~200QFPQuad-FlatPack封裝型式SurfaceMountShapeMaterialLeadPitchNoofI/OTypicalFeaturesCeramic1.27,0.762mm(50,30miles)2,4directionlead20~80FPGFlatPackageofGlassCeramic1.27,1.016,0.762mm(50,40,30miles)20~40LCCLeadlessChipCarrier封裝型式SurfaceMountShapeMaterialL
5、eadPitchNoofI/OTypicalFeaturesCeramic1.27mm(50miles)j-shapebend4directionlead18~124PLCCPlasticLeadedChipCarrierCeramic0.5mm32~200VSQFVerySmallQuadFlatpackAssemblyMainProcessDieCure(Optional)DieBondDieSawPlasmaCardAsyMemoryTestCleanerCardTestPackingforOutgoingDetaping(Optional)Grinding(Optiona
6、l)Taping(Optional)WaferMountUVCure(Optional)LasermarkPostMoldCureMoldingLaserCutPackageSawWireBondSMT(Optional)半導(dǎo)體設(shè)備供應(yīng)商介紹-前道部分半導(dǎo)體設(shè)備供應(yīng)商介紹-前道部分常用術(shù)語(yǔ)介紹SOP-StandardOperationProcedure標(biāo)準(zhǔn)操作手冊(cè)WI–WorkingInstruction作業(yè)指導(dǎo)書(shū)PM–PreventiveMaintenance預(yù)防性維護(hù)FMEA-FailureModeEffectAnalysis失效模式影響分析SPC-StatisticalPr
7、ocessControl統(tǒng)計(jì)制程控制DOE-DesignOfExperiment工程試驗(yàn)設(shè)計(jì)IQC/OQC-Incoming/OutingQualityControl來(lái)料/出貨質(zhì)量檢驗(yàn)MTBA/MTBF-MeanTimebetweenassist/Failure平均無(wú)故障工作時(shí)間CPK-品質(zhì)參數(shù)UPH-UnitsPerHour每小時(shí)產(chǎn)出QC7Tools(QualityControl品管七工具)OCAP(OutofControlActionPlan異常改善計(jì)劃)8D(問(wèn)題解決八大步
