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1、SMT製程簡介SMTPROCESSINTRODUCES.M.T.?SurfaceMountTechnology定義：是指在恰當(dāng)材質(zhì)的表面上焊牢為數(shù)極多的表面粘裝電子零件(SMDs)的裝配技術(shù).DEFINITION:Atechnologyformountingelectroniccomponents(=SMDs)onthesurfaceofsuitablesubstrate.S.M.D.?SurfaceMountDeviceSMD定義:亦稱為SMC,是指能夠藉由表面粘著技術(shù)焊接在印刷電路板上之有腳或無腳電
2、子零件.DEFINITION:(orsurfacemountcomponent,SMC),Itisaleadorleadlesselectroniccomponentthatiscapableofbeingattachedtoaprintedboardbysurfacemounting.SMTFLOW領(lǐng)料ReceiveMaterials備料PrepareMaterials錫膏印刷Printingsolderpaste零件置放Pick&PlaceCP7X3QP3X4迴焊Reflow迴焊Reflow零件置放
3、Pick&PlaceCP7X2GSM2X2錫膏印刷Printingsolderpaste轉(zhuǎn)版ReverseBoardAOIAutoOpticalInspectionAOIAutoOpticalInspection目檢VisualInspection條碼管理系統(tǒng)SFIS入庫ToEnterWarehouse出貨DeliverGoodsAOIAutoOpticalInspection1OKNG下一程序NextProcedure修整TouchUp目檢VisualInspectionOKNG修整TouchUp下一
4、程序NextProcedure目檢VisualInspection2SMTEQUIPMENT-IMPMUP3000-StencilPrinter-印刷機(jī)FUJICP643E-High-SpeedMounter-高速置件機(jī)(SmallCard)FUJICP742E/742ME-High-SpeedMounter-高速置件機(jī)(Mainboard)FUJIQP341E-Multi-Fun.Mounter-泛用置件機(jī)UNIVERSALGSM2-Multi-Fun.Mounter-泛用置件機(jī)HELLER1900E
5、XLReflow-迴焊爐ORBOTECHVT.8000X-AutoOpticalInspectionForSolderJoint-焊點(diǎn)自動(dòng)光學(xué)檢查機(jī)ORBOTECHTrin.2240-AutoOpticalInspectionForPaste-錫膏覆蓋自動(dòng)光學(xué)檢查機(jī)EFD1500XL-GlueDispensermachine–點(diǎn)膠機(jī)SMTEQUIPMENT-IIHOTPLATE-SolderBallTest-錫球試驗(yàn)儀MALCOMVISCOMETERPCU-201-ViscosityTest-粘度測試儀
6、HIROX-3DMicroscope-3D顯微鏡Z-CHECK-SolderPasteThicknessMeasurement-錫膏厚度量測儀SMTEQUIPMENT-IIIDATAPAQREFLOWTRACKER-ReflowTemperatureCurveRecord-迴焊爐溫度曲線記錄器FUJIDTIII-2DMeasurement&FeederCalibration-座標(biāo)機(jī)EMC301A-StencilCleaner-鋼板清洗機(jī)領(lǐng)料(GETTINGTHEMATERIALS)1.工程目的(ENG.
7、PURPOSE)：領(lǐng)取生產(chǎn)用料Preparetheproductionmaterials.2.作業(yè)重點(diǎn)(OPERATIONIMPORTANTS)：2.1實(shí)物與領(lǐng)料單規(guī)格相符Thematerial’sspecificationmustbethesameasyourBOM.2.2數(shù)量正確Quantitymustbecorrect.SolderPaste-ISQ-20-27Non-cleanType-免洗型0%Halogencontent-無鹵化物20-36?mparticlesize-錫球直徑20-36?m
8、9.0%Fluxcontent(RMA)-助焊劑比重9%SolderPaste-IISQ-20-27IncomingmaterialInspection-進(jìn)料檢驗(yàn)?SolderballTest-錫球試驗(yàn)?ViscosityTest-粘度試驗(yàn)Storage-儲(chǔ)存條件?0~10℃錫膏印刷-I (PRINTINGSOLDERPASTE)1.工程目的(ENG.PURPOSE)：均勻地印刷錫膏Uniformdepositingsolderpaste.
