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1、HDIManufacturingProcessFlowPre-engineeringPatternimagingEtchingLaminatingDrillingCuplatingHolepluggingPatternimagingLaminationLaserAblationMechanicaldrillingPatternimagingCuplatingSolderMaskSurfaceFinishedRoutingVisualinspectionElectrictestShippingPre-engineerin
2、gPatternimagingEtchingLaminatingDrillingDesmearCuplatingHolepluggingCuplatingBeltSandingLaminationLaserAblationMechanicaldrillingCuplatingPatternimagingSolderMaskGoldplatingRoutingElectricaltestPatternimagingHolecounterShippingVisualinspection*Rawmaterial(ThinCo
3、re,Copper,Prepreg…...)RawMaterial:FR-4(Difuntional,Tetrafuntional)Supplier:EMC,Nan-YaSheetsize:36”*48”,40”*48”,42”*48CoreThickness:0.003”,0.004”,0.005”,0.006”0.008”,0.010”,0.012”,0.015”0.021”,0.031”,0.039”,0.047”CopperFoil:1/3oz,1/2oz,1.0oz,2ozPrepregtype:1080,2
4、113,2116,1506,7628,76301.內層基板(THINCORE)LaminateCopperFoil裁板(PanelSize)COPPERFOILEpoxyGlassPhotoResist2.內層線路製作(壓膜)(DryFilmResistCoat)EtchPhotoresist(D/F)PhotoResist3.內層線路製作(曝光)(Expose)A/WArtwork(底片)Artwork(底片)AfterExposeBeforeExpose4.內層線路製作(顯影)(Develop)PhotoResis
5、t5.內層線路製作(蝕刻)(Etch)PhotoResist6.內層線路製作(去膜)(StripResist)7.黑氧化(OxideCoating)8.疊板(Lay-up)LAYER2LAYER3LAYER4LAYER5LAYER1LAYER6Layer1Layer2Layer3Layer4CopperFoilCopperFoilInnerLayerPrepreg(膠片)Prepreg(膠片)9.壓合(Lamination)典型之多層板疊板及壓合結構...COPPERFOIL0.5OZThinCore,FR-4prep
6、regCOMPS0LD.prepregThinCore,FR-4prepregCOPPERFOIL0.5OZ疊合用之鋼板疊合用之鋼板10-12層疊合壓合機之熱板壓合機之熱板COPPERFOIL0.5OZThinCore,FR-4prepregCOMPS0LD.prepregThinCore,FR-4prepregCOPPERFOIL0.5OZ疊合用之鋼板疊合用之鋼板墊木板鋁板10.鑽孔(Drilling)11.電鍍Desmear&CopperDeposition12.塞孔(HolePlugging)13.去溢膠(Bel
7、tSanding)14.減銅(CopperReduction)→Option15.去溢膠(BeltSanding)→Option16.外層壓膜DryFilmLamination(Outerlayer)PhotoResist17.外層曝光ExposeUV光源18.AfterExposed19.外層顯影Develop20.蝕刻Etch20.去乾膜StripResist21.壓合(Build-upLayerLamination)RCC(ResinCoatedCopperfoil)21.護形層製作(壓膜)(ConformalM
8、ask)DryFilm(乾膜)DryFilm(乾膜)Artwork(底片)Artwork(底片)22.護形層製作(曝光)(ConformalMask)BeforeExposureAfterExposure23.護形層製作(顯像)(ConformalMask)24.護形層製作(蝕銅)(ConformalMask)25.護形層製作(去
