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1、WIREBOND PROCESSINTRODUCTIONCONTENTSASSEMBLYFLOWOFPLASTICICWireBond原理M/CIntroductionWireBondProcessMaterialSPECCalculatorDEFECT封裝簡介晶片Die金線GoldWire導(dǎo)線架LeadframWaferGrindingDieBondingWaferSawtoasterWireBondingDieSurfaceCoatingMoldingLaserMarkSolderBallPla
2、cementSingulationPacking封裝流程DejunkTRIMSolderPlatingSolderPlatingDejunkTRIMTRIM/FORMINGBGASURFACEMOUNTPKGTHROUGHHOLEPKGWireBond原理padleadGoldwireBallBond(1stBond)WedgeBond(2ndBond)GLASSCONTAMINATIONVIBRATIONSiO2SiGOLDBALLPRESSUREMOISTUREAL2O3AlB.PRINCIPL
3、E銲接條件HARDWELDINGPressure(Force)Amplify&FrequecyWeldingTime(BondTime)WeldingTempature(Heater)THERMALBONINGThermalCompressureUltrasonicEnergy(Power)BondHeadASSYLowimpactforceRealtimeBondingForcemonitoringHighresolutionz-axispositionwith2.5micronperstepre
4、solutionFastcontactdetectionSuppressedForcevibrationFastForceresponseFastresponsevoicecoilwireclampXYTableLinear3phaseACServomotorHighpowerACCurrentAmplifierDSPbasedcontrolplatformHighX-Ypositioningaccuracyof+/-1mmResolutionof0.2mmW/HASSYchangeover·Ful
5、lyprogrammableindexer&tracks·Motorizedwindowclampwithsoftclosefeature·OutputindexerwithleadframejamprotectionfeatureToollessconversionwindowclampsandtopplateenablesfastdeviceEagleBondingSystemBondingMethod?Thermosonic(TS)BQMMode?ConstantCurrent,Voltage
6、,PowerandNormal(Programmable)LoopType?Normal,Low,Square&JXYResolution?0.2umZResolution(capillarytravellingmotion)?2.5umFinePitchCapability?35mmpitch@0.6milwireNo.ofBondingWires?upto1000ProgramStorage?1000programsonHardDiskMultimodeTransducerSystem?Prog
7、rammableprofile,controlandvibrationmodesMACHINESPECIFICATIONS(I)EagleVisionSystemPatternRecognitionTime?70ms/pointPatternRecognitionAccuracy?+0.37umLeadLocatorDetection?12ms/lead(3leads/frame)LeadLocatorAccuracy?+2.4umPostBondInspection?FirstBond,Secon
8、dBondWireTracingMax.DieLevelDifferent?400–500umFacilitiesVoltage110VAC(optional100/120/200/210/220/230/240VACMACHINESPECIFICATIONS(II)EagleMaterialHandlingSystemIndexingSpeed?200–250ms@0.5“pitchIndexerResolution?1umLeadframePositionAccu
