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1、題目:溫度控制器的設(shè)計(jì)摘要本文設(shè)計(jì)了一個(gè)溫度自動(dòng)控制器。本設(shè)計(jì)以單片機(jī)(8031)為控制核心,外加硬件電路,將溫度顯示和數(shù)字控制集和于一體,實(shí)現(xiàn)智能溫度控制。并采用軟件程序?qū)崿F(xiàn)升溫的調(diào)節(jié),能對(duì)加熱爐的升溫速度和保溫時(shí)間嚴(yán)格控制。單片機(jī)控制系統(tǒng)由微處理器和工業(yè)生產(chǎn)對(duì)象兩大部分組成。本文是通過(guò)熱敏電阻和單片機(jī)等,來(lái)實(shí)現(xiàn)對(duì)工程上一些系統(tǒng)的溫度進(jìn)行范圍控制的過(guò)程。關(guān)鍵詞:測(cè)溫;PID算法;單片機(jī);溫度ABSTRACTThispaperdescribesthedesignofaautomatictemperaturec
2、ontroller.ThedesignisbasedonSCM(8031)forthecontrolofthecore,thesur-hardwarecircuit,thetemperaturedemonstrationandthenumericalcontrolcollectionandinabody,realizestheintelligencetemperaturecontrol.Itrealizestheelevationoftemperatureadjustmentwiththesoftwarero
3、utine,canheatingfurnace'selevationoftemperaturespeedandthesoakingtimestrictcontrol.Microprocessorandmicrocontrollercontrolsystemconsistsoftwomajorcomponentsofindustrialproductionofobjects.Thisarticleisamicrocontrollersuchasthroughthethermalresistanceandtoac
4、hieveanumberofsystemengineeringonthetemperaturerangecontroloftheprocess.KEYWORDS:Measurewarm;PIDalgorithm;singleflatmachineandTemperatureController目錄摘要..............................................................IABSTRACT...................................
5、.......................II第1章前言......................................................11.1概述.......................................................21.2課題分析...................................................21.3設(shè)計(jì)思路.............................................
6、......2第2章系統(tǒng)的基本組成及工作原理....................................32.1系統(tǒng)的基本組成.............................................32.2系統(tǒng)的基本工作原理.........................................3第3章測(cè)溫電路的選擇及設(shè)計(jì)........................................53.1熱電偶測(cè)溫電路........................
7、......................53.1.1熱電偶...................................................53.1.2毫伏變送器...............................................63.2熱敏電阻測(cè)溫電路............................................63.2.1熱敏電阻.................................................63
8、.2.2關(guān)于鉑電阻的特性.........................................73.2.3溫度測(cè)量電路.............................................7第4章芯片組的電路設(shè)計(jì)...........................................84.1ADC0809與8031接口硬件電路設(shè)計(jì)............