資源描述：
《各種ic封裝形式圖片》由會員上傳分享，免費(fèi)在線閱讀，更多相關(guān)內(nèi)容在行業(yè)資料-天天文庫。
1、各種IC封裝形式圖片BGABallGridArrayEBGA680LLBGA160LPBGA217LPlasticBallGridArraySBGA192LTSBGA680LQFPQuadFlatPackageTQFP100LSBGASC-705LSDIPSIPSingleInlinePackageSOSmallOutlinePackage CLCCCNRCommunicationandNetworkingRiserSpecificationRevision1.2CPGACeramicPinGridArrayDIPDualInlinePa
2、ckageDIP-tabDualInlinePackagewithMetalHeatsinkFBGASOJ32LSOJSOPEIAJTYPEII14LSOT220SSOP16LSSOPTO18FDIPFTO220FlatPackHSOP28ITO220ITO3pJLCCTO220TO247TO264TO3TO5TO52TO71LCCLDCCLGALQFPPCDIPPGAPlasticPinGridArrayPLCC詳細(xì)規(guī)格PQFPTO72TO78TO8TO92TO93TO99TSOPThinSmallOutlinePackagePSDIP
3、LQFP100L詳細(xì)規(guī)格METALQUAD100L詳細(xì)規(guī)格PQFP100L詳細(xì)規(guī)格QFPQuadFlatPackageSOT220SOT223TSSOPorTSOPIIThinShrinkOutlinePackageuBGAMicroBallGridArrayuBGAMicroBallGridArray ZIPZig-ZagInlinePackageTEPBGA288LTEPBGAC-BendLead?CERQUADCeramicQuadFlatSOT223SOT23SOT23/SOT323SOT25/SOT353SOT26/SOT363
4、SOT343SOT523SOT89SOT89Pack詳細(xì)規(guī)格CeramicCaseLAMINATECSP112LChipScalePackage詳細(xì)規(guī)格GullWingLeads?LLP8La詳細(xì)規(guī)格PCI32bit5VPeripheralComponentInterconnect詳細(xì)規(guī)格PCI64bit3.3VSocket603FosterLAMINATETCSP20LChipScalePackageTO252TO263/TO268SODIMMSmallOutlineDualIn-lineMemoryModuleSOCKET370For
5、intel370pinPGAPentiumIII&CeleronCPUPCMCIAPDIPPLCC詳細(xì)規(guī)格SIMM30SingleIn-lineMemoryModuleSIMM72SingleIn-lineMemoryModuleSIMM72SingleIn-lineSLOT1ForintelPentiumIIPentiumIII&CeleronCPUSOCKET423Forintel423pinPGAPentium4CPUSOCKET462/SOCKETAForPGAAMDAthlon&DuronCPUSOCKET7ForintelPe
6、ntium&MMXPentiumCPUSLOTAForAMDAthlonCPUSNAPTKSNAPTKSNAPZPSOH各種封裝縮寫說明BGABQFP132BGABGABGABGABGACLCCCNRPGADIPDIP-tabBGADIPTOFlatPackHSOP28TOTOJLCCLCCCLCCBGALQFPDIPPGAPLCCPQFPDIPLQFPLQFPPQFPQFPQFPTQFPBGASC-705LDIPSIPSOSOHSOJSOJSOPTOSOPSOPCANTOTOTOTO3CANCANCANCANCANTO8TO92CANC
7、ANTSOPTSSOPorTSOPBGABGAZIPPCDIP以下封裝形式未找到相關(guān)圖片，僅作簡易描述，供參考：DIM單列直插式，塑料例如：MH88500QUIP蜘蛛腳狀四排直插式，塑料例如：NEC7810DBGABGA系列中陶瓷芯片例如：EP20K400FC672-3CBGABGA系列中金屬封裝芯片例如：EP20K300EBC652-3MODULE方形狀金屬殼雙列直插式例如：LH0084RQFPQFP封裝系列中，表面帶金屬散裝體例如：EPF10KRC系列DIMM電路正面或背面鑲有LCC封裝小芯片，陶瓷，雙列直插式例如：X28C010DI
8、P-BATTERY電池與微型芯片內(nèi)封SRAM芯片，塑料雙列直插式例如：達(dá)拉斯SRAM系列
