各種IC封裝形式圖片.doc

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1、各種IC封裝形式圖片BGABallGridArrayEBGA680L詳細(xì)規(guī)格LBGA160L詳細(xì)規(guī)格PBGA217LPlasticBallGridArray詳細(xì)規(guī)格SBGA192L詳細(xì)規(guī)格QFPQuadFlatPackageTQFP100L詳細(xì)規(guī)格SBGASC-705L詳細(xì)規(guī)格SDIPSIPSingleInlinePackageSOSmallOutlinePackage　TSBGA680L詳細(xì)規(guī)格CLCC詳細(xì)規(guī)格CNRCommunicationandNetworkingRiserSpecificationRevision1.2詳細(xì)規(guī)格CPGACeramicPinGridArray

2、DIPDualInlinePackage詳細(xì)規(guī)格SOJ32L詳細(xì)規(guī)格SOJSOPEIAJTYPEII14L詳細(xì)規(guī)格SOT220SSOP16L詳細(xì)規(guī)格SSOPDIP-tabDualInlinePackagewithMetalHeatsinkFBGAFDIPFTO220FlatPackHSOP28TO18TO220TO247TO264TO3ITO220ITO3pJLCCLCCLDCCLGATO5TO52TO71TO72TO78LQFPPCDIPPGAPlasticPinGridArray詳細(xì)規(guī)格PLCC詳細(xì)規(guī)格PQFPPSDIPTO8TO92TO93TO99TSOPThinSmall

3、OutlinePackageLQFP100L詳細(xì)規(guī)格METALQUAD100L詳細(xì)規(guī)格PQFP100L詳細(xì)規(guī)格QFPQuadFlatPackageSOT143SOT220SOT223TSSOPorTSOPIIThinShrinkOutlinePackageuBGAMicroBallGridArrayuBGAMicroBallGridArray　ZIPZig-ZagInlinePackageBQFP132TEPBGA288LTEPBGA288LSOT223SOT23SOT23/SOT323SOT25/SOT353SOT26/SOT363SOT343SOT523詳細(xì)規(guī)格C-BendL

4、ead?CERQUADCeramicQuadFlatPack詳細(xì)規(guī)格CeramicCaseLAMINATECSP112LChipScalePackage

5、In-lineMemoryModuleSOCKET370Forintel370pinPGAPentiumIII&CeleronCPUSOCKET423Forintel423pinPGAPentium4CPUSOCKET462/SOCKETAForPGAAMDAthlon&DuronCPUSOCKET7ForintelPentium&MMXPentiumCPU