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1、SMTProcessIntroduce課程的目的與目標(biāo)期望能對SMT製程有初步了解與認(rèn)識SMT(SurfaceMountTechnology)的英文縮寫,中文意思就是表面貼裝技術(shù)。是新一代的組裝技術(shù),他將傳統(tǒng)電子元件體積壓縮為大約十分之一,大大減少設(shè)計(jì)面積.6/11/20211ProcessFlowChartSMT印刷機(jī)SPI高速機(jī)泛用機(jī)ICT入庫AOIQCChartx-ray迴焊爐Visual6/11/20212MachineType收板機(jī)AOI迴焊爐泛用機(jī)高速機(jī)SPI印刷機(jī)送板機(jī)收板機(jī)AOI迴焊爐泛用機(jī)高速機(jī)SPI印刷機(jī)送板機(jī)6/11/2021
2、3SolderPrintingPick&placeReflowTurnOverBareBoardSMTProcessFlowDiagram2ndSideSMT6/11/20214SMTLayoutSetup印刷機(jī)錫膏檢測機(jī)高速機(jī)泛用機(jī)6/11/20215SMTEquipmentIntroductionScreenPrintSolderPasteMaximumSize510x508mm/(610x508mm*)MinimumSize40x50mmThicknessrange0.2–6mmUndersidecomponentclearance3-42m
3、mAlignment:StenciltoBoardRepeatability1.6Cpk@+/-25μmProductChangeover:2minutesNewProductSetup:<10minutesSupport2D(Coverage)InspectionDEKInfinityAPISolderPrintingPick&PlaceReflowSolderingAOIInspectionICTTestX-RayInspectionSolderPasteInspection6/11/20216DEK(ScreenPrintSolderPast
4、e)鋼板刮刀錫膏錫膏刮刀鋼板PCB作業(yè)內(nèi)容：將錫膏印刷於PCB上工作原理：PCB經(jīng)過設(shè)備定位後,與鋼板接觸,透過鋼板開孔藉由刮刀將錫膏給擠壓自PCB的正確位置6/11/20217SMTEquipmentIntroductionTRI7006SolderPrintingPick&PlaceReflowSolderingAOIInspectionICTTestX-RayInspectionSolderPasteInspectionSolderPasteInspection12.345600MPoints/sec(9,645fpsx1280pixel)I
5、n-Line100%ScreeningScanSpeed160mm/sec(193mm/secmax)GageRepeatabilityandReproducibilityResolution20umOpticalResolution,10~100umScanningPitchWarpCoverageScanHeightRange1.28mm32pixel(16~64suggested)6/11/20218SPI(SolderPasteInspection)錫膏膜厚測量儀工作內(nèi)容：透過光學(xué)檢測判定印刷製程穩(wěn)定度，預(yù)防不良發(fā)生工作原理：利用三角量測原
6、理檢查錫膏厚度，藉由錫膏厚度的量測可算出錫點(diǎn)的體積，面積，同時(shí)藉由量測出之高度分布情形的加以分析後，可了解錫點(diǎn)的偏移以及是否橋接Volume=Solderarea*Height6/11/20219SMTEquipmentIntroductionHigh-speedpick&placemachineMaximumcassettemountingcapacity:216componentfeedsMaximumboardsize:510x460mmMinimumboardsize:50x50mmPCboardthickness0.5~4.0mmX-Yt
7、able的精度:0.075milNCprogramstepnumber:maximum10000steps/1programs)Maximumnumberofnozzles:max.32nozzlesPlacementtacttime0.06sec/pointReliableplacementcomponentfrom0201microchipsto100x90mmQFP,BGA.PanasonicCM402-LSolderPrintingPick&PlaceReflowSolderingAOIInspectionICTTestX-RayInspe
8、ctionSolderPasteInspection6/11/202110High-speedpick&placemach
